The Reflow Solder System RSS is developed for a small budget and space purpose. It 
is an excellent tool for various solder processes and other applications. Some applications 
are: as laboratory solder system for all kind of developers implementing and researching new processes, e.g. fluxless soldering, flip-chip process, adhesive bonding, hermetic sealing under controlled atmospheres, solder bump reflowing, encapsulation of housings, soldering of power devices, heat treatment of semiconductor wafers, prototype research, quality control, environ- mental research purposes and for small pre-series or series. The chamber is hermetically 
sealed.  The total heated area is **0 mm x **0 mm for parellel processing of up to *2 wafers with **0 mm diamter each. The maximum temperature is up to **0 °C.